Bumili 23A005 sa BYCHPS
Bumili na may garantiya
23A005
- Numero ng Bahagi:
- 23A005
- Manufacturer:
- Microsemi
- Paglalarawan:
- TRANS RF BIPO 3W 400MA 55BT2
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 17245 Pieces
- Data sheet:
- 23A005.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa 23A005, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa 23A005 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Kolektor Emitter Breakdown (Max): | 22V |
|---|---|
| Type transistor: | NPN |
| Supplier aparato Package: | 55BT |
| serye: | - |
| Power - Max: | 3W |
| packaging: | Bulk |
| Package / Kaso: | 55BT |
| operating Temperature: | 200°C (TJ) |
| Noise Figure (DB Typ @ f): | - |
| Salalayan Type: | Chassis Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Bilang Bahagi: | 23A005 |
| pakinabang: | 8.5dB ~ 9.5dB |
| Frequency - Transition: | 4.3GHz |
| Ang pinalawak Paglalarawan: | RF Transistor NPN 22V 400mA 4.3GHz 3W Chassis Mount 55BT |
| paglalarawan: | TRANS RF BIPO 3W 400MA 55BT2 |
| DC Kasalukuyang Gain (HFE) (Min) @ Ic, Vce: | 20 @ 100mA, 5V |
| Current - kolektor (Ic) (Max): | 400mA |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa 23A005
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
23A008 | Microsemi Corporation | TRANS RF BIPO 5W 400MA55BT2 | Pagtatanong |
 |
BFQ67W,115 | NXP USA Inc. | TRANS NPN 10V 20MA 8GHZ SOT323 | Pagtatanong |
 |
NE856M02-T1-AZ | CEL | RF TRANSISTOR NPN SOT-89 | Pagtatanong |
 |
BFR 182W E6327 | Infineon Technologies | TRANSISTOR NPN RF 12V SOT-323 | Pagtatanong |
 |
RX1214B300Y,114 | Ampleon USA Inc. | TRANSISTOR RF LBAND SOT439A | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers