Bumili 2950802 sa BYCHPS
Bumili na may garantiya
2950802
- Numero ng Bahagi:
- 2950802
- Manufacturer:
- Phoenix Contact
- Paglalarawan:
- RELAY MODULE WITH PLUG-IN BASE
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 12891 Pieces
- Data sheet:
- 2950802.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa 2950802, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa 2950802 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| uri: | Socket |
|---|---|
| pagwawakas Style: | Screw Terminal |
| serye: | - |
| Ibang pangalan: | EMG45-RELS/K2-W230 EMG45RELSK2W230 |
| Bilang ng Posisyon: | - |
| Salalayan Type: | DIN Rail |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Bilang Bahagi: | 2950802 |
| Para sa Paggamit Sa / Kaugnay na Mga Produkto: | - |
| Mga tampok: | Diode, LED Indicator |
| Ang pinalawak Paglalarawan: | Relay Socket DIN Rail |
| paglalarawan: | RELAY MODULE WITH PLUG-IN BASE |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa 2950802
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
RSE500311 | Amphenol PCD | SMITHS | Pagtatanong |
 |
911361 | Weidmuller | RSM 1 24VAC DPDT SOCKET | Pagtatanong |
 |
2820835 | Phoenix Contact | TERM BLOCK 2POS | Pagtatanong |
 |
2-1416100-0 | TE Connectivity Potter & Brumfield Relays | RELAY SOCKET DIN SCREW DC | Pagtatanong |
 |
PT78703 | TE Connectivity Potter & Brumfield Relays | SOCKET RELAY 3P DIN RAIL PT SER | Pagtatanong |
|
RSE116754 | Amphenol PCD | LOW PROFILE | Pagtatanong |
|
RSE116679 | Amphenol PCD | LOW PROFILE, 4 POLE/10 AMP, WC | Pagtatanong |
 |
CR0095 | TE Connectivity AMP Connectors | CONNECTOR BLOCKS | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers