Bumili 450USH270MEFC22X50 sa BYCHPS
Bumili na may garantiya
450USH270MEFC22X50
- Numero ng Bahagi:
- 450USH270MEFC22X50
- Manufacturer:
- Rubycon
- Paglalarawan:
- SNAP TERMINAL
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 17795 Pieces
pagpapakilala
BYCHIPS ay ang stocking distributor para sa 450USH270MEFC22X50, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa 450USH270MEFC22X50 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| serye: | * |
|---|---|
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 16 Weeks |
| Manufacturer Bilang Bahagi: | 450USH270MEFC22X50 |
| Ang pinalawak Paglalarawan: | Aluminum Capacitors |
| paglalarawan: | SNAP TERMINAL |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa 450USH270MEFC22X50
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
450USH270MEFCSN25X35 | Rubycon | CAP ALUM 270UF 20% 450V SNAP | Pagtatanong |
|
450USH820MEFC35X50 | Rubycon | CAP ALUM 820UF 20% 450V SNAP | Pagtatanong |
|
450USH330MEFC30X30 | Rubycon | CAP ALUM 330UF 20% 450V SNAP | Pagtatanong |
|
450USH270MEFC25X35 | Rubycon | CAP ALUM 270UF 20% 450V SNAP | Pagtatanong |
 |
B43231B5686M | EPCOS (TDK) | CAP ALUM 68UF 20% 450V SNAP | Pagtatanong |
|
450USH330MEFCSN30X30 | Rubycon | CAP ALUM 330UF 20% 450V SNAP | Pagtatanong |
 |
860160481038 | Wurth Electronics Inc. | CAP 3300 UF 20% 25 V | Pagtatanong |
|
450USH220MEFC25X30 | Rubycon | CAP ALUM 220UF 20% 450V SNAP | Pagtatanong |
|
450USH120MEFC22X25 | Rubycon | CAP ALUM 120UF 20% 450V SNAP | Pagtatanong |
|
450USH470MEFC35X35 | Rubycon | SNAP TERMINAL | Pagtatanong |
|
450USH180MEFC25X25 | Rubycon | CAP ALUM 180UF 20% 450V SNAP | Pagtatanong |
|
450USH330MEFC25X40 | Rubycon | CAP ALUM 330UF 20% 450V SNAP | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog