Bumili 5T93GL04PGGI sa BYCHPS
Bumili na may garantiya
5T93GL04PGGI
- Numero ng Bahagi:
- 5T93GL04PGGI
- Manufacturer:
- IDT (Integrated Device Technology)
- Paglalarawan:
- IC CLK BUFFER 2:4 450MHZ 24TSSOP
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 16409 Pieces
- Data sheet:
- 5T93GL04PGGI.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa 5T93GL04PGGI, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa 5T93GL04PGGI sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Supply: | 2.3 V ~ 2.7 V |
|---|---|
| uri: | Fanout Buffer (Distribution), Multiplexer |
| Supplier aparato Package: | 24-TSSOP |
| serye: | TeraBuffer™ II |
| Ratio - Input: Output: | 2:4 |
| packaging: | Tube |
| Package / Kaso: | 24-TSSOP (0.173", 4.40mm Width) |
| output: | LVDS |
| Ibang pangalan: | 800-2434-5 IDT5T93GL04PGGI IDT5T93GL04PGGI-ND |
| operating Temperature: | -40°C ~ 85°C |
| Bilang ng Circuits: | 1 |
| Salalayan Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Bilang Bahagi: | 5T93GL04PGGI |
| input: | CML, eHSTL, HSTL, LVDS, LVPECL, LVTTL |
| Frequency - Max: | 450MHz |
| Ang pinalawak Paglalarawan: | Clock Fanout Buffer (Distribution), Multiplexer IC 450MHz 24-TSSOP (0.173", 4.40mm Width) |
| Differential - Input: Output: | Yes/Yes |
| paglalarawan: | IC CLK BUFFER 2:4 450MHZ 24TSSOP |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa 5T93GL04PGGI
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers