Bumili 72T36105L4-4BB sa BYCHPS
Bumili na may garantiya
72T36105L4-4BB
- Numero ng Bahagi:
- 72T36105L4-4BB
- Manufacturer:
- IDT (Integrated Device Technology)
- Paglalarawan:
- IC FIFO 131X18 4-4NS 240BGA
- Lead Free Status / Katayuan ng RoHS:
- Naglalaman ng lead / RoHS di-sang-ayon
- Magagamit na Dami:
- 14663 Pieces
- Data sheet:
- 72T36105L4-4BB.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa 72T36105L4-4BB, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa 72T36105L4-4BB sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Supply: | 2.375 V ~ 2.625 V |
|---|---|
| Supplier aparato Package: | 240-PBGA (19x19) |
| serye: | 72T |
| muling ipadala Capability: | Yes |
| Programmable Flags Support: | Yes |
| packaging: | Tray |
| Package / Kaso: | 240-BGA |
| Ibang pangalan: | IDT72T36105L4-4BB IDT72T36105L4-4BB-ND |
| operating Temperature: | 0°C ~ 70°C |
| Salalayan Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Size memory: | 2.25M (64K x 36) |
| Tagagawa Standard Lead Time: | 16 Weeks |
| Manufacturer Bilang Bahagi: | 72T36105L4-4BB |
| tungkulin: | Asynchronous, Synchronous |
| FWFT Support: | Yes |
| Type expansion: | Depth, Width |
| paglalarawan: | IC FIFO 131X18 4-4NS 240BGA |
| Rate data: | 100MHz, 225MHz |
| Current - Supply (Max): | 90mA |
| bus Directional: | Uni-Directional |
| Access Time: | 8ns, 3.4ns |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa 72T36105L4-4BB
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers