Bumili A2F200M3F-1FGG484I sa BYCHPS
Bumili na may garantiya
A2F200M3F-1FGG484I
- Numero ng Bahagi:
- A2F200M3F-1FGG484I
- Manufacturer:
- Microsemi
- Paglalarawan:
- IC FPGA 200K GATES 256KB 256-BGA
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 14058 Pieces
- Data sheet:
- A2F200M3F-1FGG484I.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa A2F200M3F-1FGG484I, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa A2F200M3F-1FGG484I sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Supplier aparato Package: | 484-FPBGA (23x23) |
|---|---|
| bilis: | 100MHz |
| serye: | SmartFusion® |
| pangunahing Katangian: | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops |
| Peripherals: | DMA, POR, WDT |
| packaging: | Tray |
| Package / Kaso: | 484-BGA |
| operating Temperature: | -40°C ~ 100°C (TJ) |
| Bilang ng I / O: | MCU - 41, FPGA - 94 |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Manufacturer Bilang Bahagi: | A2F200M3F-1FGG484I |
| MCU RAM: | 64KB |
| MCU Flash: | 256KB |
| Ang pinalawak Paglalarawan: | ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion® ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops 256KB 64KB 100MHz 484-FPBGA (23x23) |
| paglalarawan: | IC FPGA 200K GATES 256KB 256-BGA |
| core Processor: | ARM® Cortex®-M3 |
| Connectivity: | EBI/EMI, Ethernet, I²C, SPI, UART/USART |
| arkitektura: | MCU, FPGA |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa A2F200M3F-1FGG484I
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers