Bumili A3P600L-1FG484I sa BYCHPS
Bumili na may garantiya
A3P600L-1FG484I
- Numero ng Bahagi:
- A3P600L-1FG484I
- Manufacturer:
- Microsemi
- Paglalarawan:
- IC FPGA 235 I/O 484FBGA
- Lead Free Status / Katayuan ng RoHS:
- Naglalaman ng lead / RoHS di-sang-ayon
- Magagamit na Dami:
- 16165 Pieces
- Data sheet:
- A3P600L-1FG484I.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa A3P600L-1FG484I, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa A3P600L-1FG484I sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Supply: | 1.14V ~ 1.575 V |
|---|---|
| Kabuuang RAM Bits: | 110592 |
| Supplier aparato Package: | 484-FPBGA (23x23) |
| serye: | ProASIC3L |
| Package / Kaso: | 484-BGA |
| operating Temperature: | -40°C ~ 100°C (TJ) |
| Bilang ng I / O: | 235 |
| Bilang ng mga Gates: | 600000 |
| Salalayan Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Manufacturer Bilang Bahagi: | A3P600L-1FG484I |
| paglalarawan: | IC FPGA 235 I/O 484FBGA |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa A3P600L-1FG484I
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers