Bumili AGL600V2-FG144 sa BYCHPS
Bumili na may garantiya
AGL600V2-FG144
- Numero ng Bahagi:
- AGL600V2-FG144
- Manufacturer:
- Microsemi
- Paglalarawan:
- IC FPGA 97 I/O 144FBGA
- Lead Free Status / Katayuan ng RoHS:
- Naglalaman ng lead / RoHS di-sang-ayon
- Magagamit na Dami:
- 17787 Pieces
- Data sheet:
- AGL600V2-FG144.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa AGL600V2-FG144, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa AGL600V2-FG144 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Supply: | 1.14 V ~ 1.575 V |
|---|---|
| Kabuuang RAM Bits: | 110592 |
| Supplier aparato Package: | 144-FPBGA (13x13) |
| serye: | IGLOO |
| Package / Kaso: | 144-LBGA |
| operating Temperature: | 0°C ~ 70°C (TA) |
| Bilang ng Logic Elements / Cells: | 13824 |
| Bilang ng I / O: | 97 |
| Bilang ng mga Gates: | 600000 |
| Salalayan Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Tagagawa Standard Lead Time: | 22 Weeks |
| Manufacturer Bilang Bahagi: | AGL600V2-FG144 |
| paglalarawan: | IC FPGA 97 I/O 144FBGA |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa AGL600V2-FG144
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers