Bumili APTGT300DU120G sa BYCHPS
Bumili na may garantiya
APTGT300DU120G
- Numero ng Bahagi:
- APTGT300DU120G
- Manufacturer:
- Microsemi
- Paglalarawan:
- IGBT MOD TRENCH DUAL SOURCE SP6
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 19831 Pieces
- Data sheet:
- 1.APTGT300DU120G.pdf2.APTGT300DU120G.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa APTGT300DU120G, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa APTGT300DU120G sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Kolektor Emitter Breakdown (Max): | 1200V |
|---|---|
| Vce (on) (Max) @ Vge, Ic: | 2.1V @ 15V, 300A |
| Supplier aparato Package: | SP6 |
| serye: | - |
| Power - Max: | 1380W |
| Package / Kaso: | SP6 |
| operating Temperature: | -40°C ~ 150°C (TJ) |
| NTC Thermistor: | No |
| Salalayan Type: | Chassis Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 22 Weeks |
| Manufacturer Bilang Bahagi: | APTGT300DU120G |
| Input Kapasidad (CIEs) @ Vce: | 21nF @ 25V |
| input: | Standard |
| Type IGBT: | Trench Field Stop |
| Ang pinalawak Paglalarawan: | IGBT Module Trench Field Stop Dual, Common Source 1200V 420A 1380W Chassis Mount SP6 |
| paglalarawan: | IGBT MOD TRENCH DUAL SOURCE SP6 |
| Current - Kolektor Cutoff (Max): | 500µA |
| Current - kolektor (Ic) (Max): | 420A |
| configuration: | Dual, Common Source |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa APTGT300DU120G
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers