Bumili APTGT50TL601G sa BYCHPS
Bumili na may garantiya
APTGT50TL601G
- Numero ng Bahagi:
- APTGT50TL601G
- Manufacturer:
- Microsemi
- Paglalarawan:
- POWER MODULE IGBT 600V 50A SP1
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 12211 Pieces
- Data sheet:
- 1.APTGT50TL601G.pdf2.APTGT50TL601G.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa APTGT50TL601G, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa APTGT50TL601G sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Kolektor Emitter Breakdown (Max): | 600V |
|---|---|
| Vce (on) (Max) @ Vge, Ic: | 1.9V @ 15V, 50A |
| Supplier aparato Package: | SP1 |
| serye: | - |
| Power - Max: | 176W |
| Package / Kaso: | SP1 |
| Ibang pangalan: | APTGT50TL601GMI APTGT50TL601GMI-ND |
| operating Temperature: | -40°C ~ 175°C (TJ) |
| NTC Thermistor: | No |
| Salalayan Type: | Chassis Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 22 Weeks |
| Manufacturer Bilang Bahagi: | APTGT50TL601G |
| Input Kapasidad (CIEs) @ Vce: | 3.15nF @ 25V |
| input: | Standard |
| Type IGBT: | Trench Field Stop |
| Ang pinalawak Paglalarawan: | IGBT Module Trench Field Stop Three Level Inverter 600V 80A 176W Chassis Mount SP1 |
| paglalarawan: | POWER MODULE IGBT 600V 50A SP1 |
| Current - Kolektor Cutoff (Max): | 250µA |
| Current - kolektor (Ic) (Max): | 80A |
| configuration: | Three Level Inverter |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa APTGT50TL601G
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers