Bumili AS3501-EQFP sa BYCHPS
Bumili na may garantiya
AS3501-EQFP
- Numero ng Bahagi:
- AS3501-EQFP
- Manufacturer:
- ams
- Paglalarawan:
- IC ACTIVE NOISE CANCEL 24-QFN
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 16303 Pieces
- Data sheet:
- 1.AS3501-EQFP.pdf2.AS3501-EQFP.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa AS3501-EQFP, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa AS3501-EQFP sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Supply: | 1 V ~ 1.8 V |
|---|---|
| Supplier aparato Package: | 24-QFN (4x4) |
| serye: | - |
| packaging: | Original-Reel® |
| Package / Kaso: | 24-VFQFN Exposed Pad |
| Ibang pangalan: | AS3501-EQFPDKR |
| Bilang ng Mga Filter: | 1 |
| Salalayan Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 3 (168 Hours) |
| Tagagawa Standard Lead Time: | 16 Weeks |
| Manufacturer Bilang Bahagi: | AS3501-EQFP |
| Frequency - Cutoff o Center: | - |
| Uri ng Filter: | - |
| Filter Order: | - |
| paglalarawan: | IC ACTIVE NOISE CANCEL 24-QFN |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa AS3501-EQFP
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
AS3502-EQFP-500 | ams | IC HEADPHONE NOISE-CANCEL 32-QFN | Pagtatanong |
|
AS3502-EQFP | ams | IC HEADPHONE NOISE-CANCEL 32-QFN | Pagtatanong |
 |
MAX7400EPA+ | Maxim Integrated | IC FILTER LOWPASS 8-DIP | Pagtatanong |
|
AS3501-EQFP-500 | ams | IC HEADPHONE NOISE-CANCEL 24-QFN | Pagtatanong |
 |
MAX268BENG | Maxim Integrated | IC FILTER SW CAP BANDPASS 24-DIP | Pagtatanong |
 |
MAX7408CUA+ | Maxim Integrated | IC FILTER LOWPASS 5TH 8UMAX | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers