Bumili B82725J2103N20 sa BYCHPS
Bumili na may garantiya
B82725J2103N20
- Numero ng Bahagi:
- B82725J2103N20
- Manufacturer:
- EPCOS
- Paglalarawan:
- RING CORE DBL CHOKE 2MH 10A
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 13982 Pieces
- Data sheet:
- B82725J2103N20.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa B82725J2103N20, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa B82725J2103N20 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| serye: | B82725 |
|---|---|
| Ibang pangalan: | B82725J2103N 20 B82725J2103N020 |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 34 Weeks |
| Manufacturer Bilang Bahagi: | B82725J2103N20 |
| Ang pinalawak Paglalarawan: | Line Common Mode Choke DCR |
| paglalarawan: | RING CORE DBL CHOKE 2MH 10A |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa B82725J2103N20
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
B82725J2102N20 | EPCOS (TDK) | COMMON MODE CHOKE 68MH 1A 2LN TH | Pagtatanong |
 |
B82725J2802N20 | EPCOS (TDK) | CMC 3.9MH 8A 2LN TH | Pagtatanong |
|
B82725J2202N20 | EPCOS (TDK) | COMMON MODE CHOKE 18MH 2A 2LN TH | Pagtatanong |
|
B82725J2103N22 | EPCOS (TDK) | CMC 1.8MH 10A 2LN TH | Pagtatanong |
|
B82725J2103N21 | EPCOS (TDK) | CMC 2.5MH 10A 2LN TH | Pagtatanong |
|
B82725A2402N20 | EPCOS (TDK) | COMMON MODE CHOKE 14MH 4A 2LN TH | Pagtatanong |
|
B82725J2602N40 | EPCOS (TDK) | CMC 7.5MH 6A 2LN TH | Pagtatanong |
|
B82725J2602N20 | EPCOS (TDK) | CMC 3.9MH 6A 2LN TH | Pagtatanong |
|
B82725J2602N1 | EPCOS (TDK) | CMC 3.9MH 6A 2LN TH | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers