Bumili B82725S2602N1 sa BYCHPS
Bumili na may garantiya
B82725S2602N1
- Numero ng Bahagi:
- B82725S2602N1
- Manufacturer:
- EPCOS
- Paglalarawan:
- RING CORE DBL CHOKE 3.9MH 6A
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 12775 Pieces
- Data sheet:
- B82725S2602N1.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa B82725S2602N1, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa B82725S2602N1 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| serye: | B82725 |
|---|---|
| Ibang pangalan: | B82725S2602N 1 B82725S2602N001 |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Bilang Bahagi: | B82725S2602N1 |
| Ang pinalawak Paglalarawan: | Line Common Mode Choke DCR |
| paglalarawan: | RING CORE DBL CHOKE 3.9MH 6A |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa B82725S2602N1
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
B82725S2602N2 | EPCOS (TDK) | CMC 3.9MH 6A 2LN TH | Pagtatanong |
|
B82725S2602N41 | EPCOS (TDK) | CMC 7.8MH 6A 2LN TH | Pagtatanong |
 |
B82725J2602N1 | EPCOS (TDK) | CMC 3.9MH 6A 2LN TH | Pagtatanong |
 |
B82725S2103N3 | EPCOS (TDK) | CMC 2.8MH 10A 2LN TH | Pagtatanong |
|
B82725S2602N40 | EPCOS (TDK) | RING CORE DBL CHOKE 7.8MH 6A | Pagtatanong |
 |
B82725S2103N4 | EPCOS (TDK) | CMC 3.3MH 10A 2LN TH | Pagtatanong |
|
B82725S2802N21 | EPCOS (TDK) | RING CORE DBL CHOKE 3.1MH 8A | Pagtatanong |
|
B82725S2253N40 | EPCOS (TDK) | RING CORE DBL CHOKE 1.0MH 25A | Pagtatanong |
|
B82725A2402N20 | EPCOS (TDK) | COMMON MODE CHOKE 14MH 4A 2LN TH | Pagtatanong |
|
B82725S2163N40 | EPCOS (TDK) | RING CORE DBL CHOKE 1.2MH 16A | Pagtatanong |
|
B82725J2102N20 | EPCOS (TDK) | COMMON MODE CHOKE 68MH 1A 2LN TH | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog