Bumili BF1429 sa BYCHPS
Bumili na may garantiya
BF1429
- Numero ng Bahagi:
- BF1429
- Manufacturer:
- API Delevan
- Paglalarawan:
- FERRITE CORE 157 OHM HINGED
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 14450 Pieces
- Data sheet:
- BF1429.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa BF1429, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa BF1429 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| uri: | Round |
|---|---|
| serye: | BF |
| Ratings: | - |
| Outer Dimensyon: | 0.571" W x 0.610" H (14.50mm x 15.70mm) |
| Ibang pangalan: | BF1429 BULK 500 DN4709 |
| Salalayan Type: | Free Hanging |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| materyal: | API-1 |
| Tagagawa Standard Lead Time: | 8 Weeks |
| Manufacturer Bilang Bahagi: | BF1429 |
| Haba: | 1.140" (28.96mm) |
| Inner Dimensyon: | 0.220" Dia (5.60mm) |
| Impedance @ Frequency: | 157 Ohm @ 100MHz |
| Ang pinalawak Paglalarawan: | Hinged (Snap On) Free Hanging Ferrite Core 157 Ohm @ 100MHz ID 0.220" Dia (5.60mm) OD 0.571" W x 0.610" H (14.50mm x 15.70mm) Length 1.140" (28.96mm) |
| disenyo: | Hinged (Snap On) |
| paglalarawan: | FERRITE CORE 157 OHM HINGED |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa BF1429
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
28R0492-100 | Laird-Signal Integrity Products | FERRITE CORE 150 OHM SOLID | Pagtatanong |
 |
28A2738-0A0 | Laird-Signal Integrity Products | FERRITE CORE 233 OHM HINGED 8MM | Pagtatanong |
 |
7427226 | Wurth Electronics Inc. | FERRITE CORE 75 OHM SOLID | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers