Bumili BM63364S-VC sa BYCHPS
Bumili na may garantiya
BM63364S-VC
- Numero ng Bahagi:
- BM63364S-VC
- Manufacturer:
- LAPIS Semiconductor
- Paglalarawan:
- IC IPM 600V IGBT SW 25HSDIP
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 17674 Pieces
- Data sheet:
- BM63364S-VC.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa BM63364S-VC, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa BM63364S-VC sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Isolation: | 1500Vrms |
|---|---|
| Boltahe: | 600V |
| uri: | IGBT |
| serye: | - |
| Package / Kaso: | 25-PowerDIP Module (1.327", 33.70mm) |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 13 Weeks |
| Manufacturer Bilang Bahagi: | BM63364S-VC |
| Ang pinalawak Paglalarawan: | Power Driver Module IGBT 3 Phase Inverter 600V 15A 25-PowerDIP Module (1.327", 33.70mm) |
| paglalarawan: | IC IPM 600V IGBT SW 25HSDIP |
| kasalukuyan: | 15A |
| configuration: | 3 Phase Inverter |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa BM63364S-VC
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
BM63363S-VA | Rohm Semiconductor | IC IPM 600V IGBT SW 25HSDIP | Pagtatanong |
|
BM63364S-VA | Rohm Semiconductor | IC IPM 600V IGBT SW 25HSDIP | Pagtatanong |
 |
IKCM30F60HDXKMA1 | Infineon Technologies | IFPS MODULES 24MDIP | Pagtatanong |
 |
PS12036 | Powerex Inc. | MOD IPM 3PHASE IGBT 1200V 15A | Pagtatanong |
 |
BM63363S-VC | Rohm Semiconductor | IC IPM 600V IGBT SW 25HSDIP | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog