Bumili DMN3190LDW-13 sa BYCHPS
Bumili na may garantiya
DMN3190LDW-13
- Numero ng Bahagi:
- DMN3190LDW-13
- Manufacturer:
- Diodes Incorporated
- Paglalarawan:
- MOSFET 2N-CH 30V 1A SOT363
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 16599 Pieces
- Data sheet:
- DMN3190LDW-13.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa DMN3190LDW-13, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa DMN3190LDW-13 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Vgs (th) (Max) @ Id: | 2.8V @ 250µA |
|---|---|
| Supplier aparato Package: | SOT-363 |
| serye: | - |
| Rds On (Max) @ Id, Vgs: | 190 mOhm @ 1.3A, 10V |
| Power - Max: | 320mW |
| packaging: | Tape & Reel (TR) |
| Package / Kaso: | 6-TSSOP, SC-88, SOT-363 |
| Ibang pangalan: | DMN3190LDW-13DI DMN3190LDW-13DI-ND DMN3190LDW-13DITR |
| operating Temperature: | -55°C ~ 150°C (TJ) |
| Salalayan Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 8 Weeks |
| Manufacturer Bilang Bahagi: | DMN3190LDW-13 |
| Input Kapasidad (Ciss) (Max) @ Vds: | 87pF @ 20V |
| Gate Charge (Qg) (Max) @ Vgs: | 2nC @ 10V |
| Type FET: | 2 N-Channel (Dual) |
| FET Tampok: | Logic Level Gate |
| Ang pinalawak Paglalarawan: | Mosfet Array 2 N-Channel (Dual) 30V 1A 320mW Surface Mount SOT-363 |
| Alisan ng tubig sa Source Boltahe (Vdss): | 30V |
| paglalarawan: | MOSFET 2N-CH 30V 1A SOT363 |
| Current - Ang patuloy Drain (Id) @ 25 ° C: | 1A |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa DMN3190LDW-13
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog