Bumili DS1123LE-50+W sa BYCHPS
Bumili na may garantiya
DS1123LE-50+W
- Numero ng Bahagi:
- DS1123LE-50+W
- Manufacturer:
- Maxim Integrated
- Paglalarawan:
- IC DEL LN 256TAP 127.5NS 16TSSOP
- Magagamit na Dami:
- 14975 Pieces
- Data sheet:
- DS1123LE-50+W.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa DS1123LE-50+W, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa DS1123LE-50+W sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Supplier aparato Package: | 16-TSSOP |
|---|---|
| serye: | * |
| packaging: | Tube |
| Package / Kaso: | - |
| Salalayan Type: | Surface Mount |
| Manufacturer Bilang Bahagi: | DS1123LE-50+W |
| Ang pinalawak Paglalarawan: | Delay Line IC Tap |
| paglalarawan: | IC DEL LN 256TAP 127.5NS 16TSSOP |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa DS1123LE-50+W
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
DS1123LE-100+ | Maxim Integrated | IC DELAY LN 256TAP 255NS 16TSSOP | Pagtatanong |
|
DS1123LE-50+ | Maxim Integrated | IC DEL LN 256TAP 127.5NS 16TSSOP | Pagtatanong |
|
DS1123LE-25+ | Maxim Integrated | IC DEL LN 256TAP 63.75NS 16TSSOP | Pagtatanong |
 |
DS1110S-175+ | Maxim Integrated | IC DELAY LINE 10TAP 175NS 16SOIC | Pagtatanong |
|
DS1123LE-200+ | Maxim Integrated | IC DELAY LN 256TAP 510NS 16TSSOP | Pagtatanong |
|
DS1100LZ-125+ | Maxim Integrated | IC DELAY LINE 5TAP 125NS 8SOIC | Pagtatanong |
|
DS1110S-400 | Maxim Integrated | IC DELAY LINE 10TAP 400NS 16SOIC | Pagtatanong |
 |
DS1135LU-300/T&R | Maxim Integrated | IC DELAY LINE 300NS 8UMAX | Pagtatanong |
 |
DS1124U-25+T | Maxim Integrated | IC DEL LN 256TAP 83.75NS 10UMAX | Pagtatanong |
|
DS1124U-25+ | Maxim Integrated | IC DEL LN 256TAP 83.75NS 10UMAX | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers