Bumili DS21S07AE+ sa BYCHPS
Bumili na may garantiya
DS21S07AE+
- Numero ng Bahagi:
- DS21S07AE+
- Manufacturer:
- Maxim Integrated
- Paglalarawan:
- IC TERMINATOR SCSI 20-TSSOP
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 17644 Pieces
- Data sheet:
- DS21S07AE+.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa DS21S07AE+, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa DS21S07AE+ sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Supply: | 4 V ~ 5.5 V |
|---|---|
| uri: | SCSI, LVD, SE |
| Supplier aparato Package: | 20-TSSOP |
| serye: | - |
| packaging: | Tube |
| Package / Kaso: | 20-TSSOP (0.173", 4.40mm Width) |
| operating Temperature: | 0°C ~ 70°C |
| Bilang ng mga Terminations: | 9 |
| Salalayan Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Bilang Bahagi: | DS21S07AE+ |
| Ang pinalawak Paglalarawan: | SCSI, LVD, SE Terminator Terminations 20-TSSOP |
| paglalarawan: | IC TERMINATOR SCSI 20-TSSOP |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa DS21S07AE+
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
DS21S07AE | Maxim Integrated | IC TERMINATOR SCSI 20-TSSOP | Pagtatanong |
|
DS21S07AE/T&R | Maxim Integrated | IC TERMINATOR SCSI 20-TSSOP | Pagtatanong |
 |
DS21S07AS+T&R | Maxim Integrated | IC TERMINATOR SCSI 16-SOIC | Pagtatanong |
|
DS21S07AS/T&R | Maxim Integrated | IC TERMINATOR SCSI 16-SOIC | Pagtatanong |
|
DS21S07AS | Maxim Integrated | IC TERMINATOR SCSI 16-SOIC | Pagtatanong |
|
DS21S07AE+T&R | Maxim Integrated | IC TERMINATOR SCSI 20-TSSOP | Pagtatanong |
|
DS21S07AS+ | Maxim Integrated | IC TERMINATOR SCSI 16-SOIC | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers