Bumili LM63CIMAX/NOPB sa BYCHPS
Bumili na may garantiya
LM63CIMAX/NOPB
- Numero ng Bahagi:
- LM63CIMAX/NOPB
- Manufacturer:
- Paglalarawan:
- IC TEMP SENSOR REMOTE 8-SOIC
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 15447 Pieces
- Data sheet:
- LM63CIMAX/NOPB.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa LM63CIMAX/NOPB, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa LM63CIMAX/NOPB sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Supply: | 3 V ~ 3.6 V |
|---|---|
| topology: | ADC (Sigma Delta), Comparator, Fan Speed Control, Register Bank |
| Supplier aparato Package: | 8-SOIC |
| serye: | - |
| Type sensor: | Internal and External |
| sensing Temperature: | 0°C ~ 125°C |
| packaging: | Tape & Reel (TR) |
| Package / Kaso: | 8-SOIC (0.154", 3.90mm Width) |
| Type output: | 2-Wire SMBus |
| output Fan: | Yes |
| output Alarm: | Yes |
| Ibang pangalan: | LM63CIMAX/NOPBTR LM63CIMAXNOPB |
| operating Temperature: | 0°C ~ 85°C |
| Salalayan Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 6 Weeks |
| Manufacturer Bilang Bahagi: | LM63CIMAX/NOPB |
| tungkulin: | Fan Control, Temp Monitor |
| Ang pinalawak Paglalarawan: | Fan Control, Temp Monitor 0°C ~ 125°C Internal and External Sensor 2-Wire SMBus Output 8-SOIC |
| paglalarawan: | IC TEMP SENSOR REMOTE 8-SOIC |
| katumpakan: | ±3°C |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa LM63CIMAX/NOPB
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
EMC2113-1-AP-TR | Microchip Technology | IC RPM FAN CTRLR 16QFN | Pagtatanong |
|
LM63CIMAX | Texas Instruments | IC TEMP SENSOR REMOTE 8-SOIC | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers