Bumili LT8570IMS8E-1#PBF sa BYCHPS
Bumili na may garantiya
LT8570IMS8E-1#PBF
- Numero ng Bahagi:
- LT8570IMS8E-1#PBF
- Manufacturer:
- L
- Paglalarawan:
- IC REG MULT CONFIG INV ADJ 8MSOP
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 14011 Pieces
- Data sheet:
- LT8570IMS8E-1#PBF.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa LT8570IMS8E-1#PBF, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa LT8570IMS8E-1#PBF sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Output (Min / Fixed): | 3mV, 1.204V |
|---|---|
| Boltahe - Output (Max): | 65V (Switch) |
| Boltahe - Input (Min): | 2.55V |
| Boltahe - Input (Max): | 40V |
| topology: | Boost, Charge Pump, Cuk, SEPIC |
| Sabay-sabay na Rectifier: | No |
| Supplier aparato Package: | 8-MSOP-EP |
| serye: | - |
| packaging: | Tube |
| Package / Kaso: | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Exposed Pad |
| Type output: | Adjustable |
| output Configuration: | Positive or Negative |
| operating Temperature: | -40°C ~ 125°C (TJ) |
| Bilang ng mga Outputs: | 1 |
| Salalayan Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 8 Weeks |
| Manufacturer Bilang Bahagi: | LT8570IMS8E-1#PBF |
| tungkulin: | Step-Up, Step-Up/Step-Down |
| Frequency - Paglipat: | 200kHz ~ 1.5MHz |
| Ang pinalawak Paglalarawan: | Boost, Charge Pump, Cuk, SEPIC Switching Regulator IC Positive or Negative Adjustable 3mV, 1.204V 1 Output 375mA 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Exposed Pad |
| paglalarawan: | IC REG MULT CONFIG INV ADJ 8MSOP |
| Current - Output: | 375mA |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa LT8570IMS8E-1#PBF
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers