Bumili LX7201-15ISF sa BYCHPS
Bumili na may garantiya
LX7201-15ISF
- Numero ng Bahagi:
- LX7201-15ISF
- Manufacturer:
- Microsemi
- Paglalarawan:
- IC USB LINE TERM EMI/ESD SOT23-6
- Lead Free Status / Katayuan ng RoHS:
- Naglalaman ng lead / RoHS di-sang-ayon
- Magagamit na Dami:
- 18714 Pieces
- Data sheet:
- LX7201-15ISF.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa LX7201-15ISF, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa LX7201-15ISF sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Supply: | 5.25V |
|---|---|
| uri: | USB |
| Supplier aparato Package: | SOT-23-6 |
| serye: | - |
| packaging: | Tube |
| Package / Kaso: | SOT-23-6 |
| operating Temperature: | -40°C ~ 125°C |
| Bilang ng mga Terminations: | 2 |
| Salalayan Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Bilang Bahagi: | LX7201-15ISF |
| Ang pinalawak Paglalarawan: | USB Terminator Terminations SOT-23-6 |
| paglalarawan: | IC USB LINE TERM EMI/ESD SOT23-6 |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa LX7201-15ISF
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
LX7201-22ISF | Microsemi Corporation | IC USB EMI FLTR ESD PROT SOT23-6 | Pagtatanong |
|
LX7203-22ISM | Microsemi Corporation | IC USB LINE TERM EMI/ESD SC70-6 | Pagtatanong |
|
LX7202-15ISF | Microsemi Corporation | IC USB LINE TERM EMI/ESD SOT23-6 | Pagtatanong |
|
LX7203-15ISM | Microsemi Corporation | IC USB LINE TERM EMI/ESD SC70-6 | Pagtatanong |
|
LX7202-22ISF | Microsemi Corporation | IC USB LINE TERM EMI/ESD SOT23-6 | Pagtatanong |
 |
UCC5621MWP | Texas Instruments | IC SCSI 27-LINE TERM 44-SSOP | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers