Bumili MAX3394EEBL+T sa BYCHPS
Bumili na may garantiya
MAX3394EEBL+T
- Numero ng Bahagi:
- MAX3394EEBL+T
- Manufacturer:
- Maxim Integrated
- Paglalarawan:
- IC LVL XLTR LV 6MBPS PP 9-UCSP
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 19179 Pieces
- Data sheet:
- 1.MAX3394EEBL+T.pdf2.MAX3394EEBL+T.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa MAX3394EEBL+T, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa MAX3394EEBL+T sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - VCCB: | 1.65 V ~ 5.5 V |
|---|---|
| Boltahe - VCCA: | 1.2 V ~ 5.5 V |
| Uri ng Tagasalin: | Voltage Level |
| Supplier aparato Package: | 9-UCSP (3x3) |
| serye: | - |
| packaging: | Tape & Reel (TR) |
| Package / Kaso: | 8-WFBGA, CSPBGA |
| Type output: | Open Drain, Push-Pull, Tri-State |
| output Signal: | - |
| Ibang pangalan: | MAX3394EEBL+T-ND MAX3394EEBL+TTR MAX3394EEBLT |
| operating Temperature: | -40°C ~ 85°C (TA) |
| Bilang ng Circuits: | 1 |
| Salalayan Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 6 Weeks |
| Manufacturer Bilang Bahagi: | MAX3394EEBL+T |
| input Signal: | - |
| Mga tampok: | Auto-Direction Sensing, Power Supply Decoupling, Thermal-Shutdown Protection |
| Ang pinalawak Paglalarawan: | Voltage Level Translator Bidirectional 1 Circuit 2 Channel 6Mbps 9-UCSP (3x3) |
| paglalarawan: | IC LVL XLTR LV 6MBPS PP 9-UCSP |
| Rate data: | 6Mbps |
| Channels per Circuit: | 2 |
| Base-Emitter Saturation Voltage (Max): | Bidirectional |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa MAX3394EEBL+T
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers