Bumili MAX4022ESD+ sa BYCHPS
Bumili na may garantiya
MAX4022ESD+
- Numero ng Bahagi:
- MAX4022ESD+
- Manufacturer:
- Maxim Integrated
- Paglalarawan:
- IC OPAMP BUFFER 200MHZ 14SOIC
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 17877 Pieces
- Data sheet:
- 1.MAX4022ESD+.pdf2.MAX4022ESD+.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa MAX4022ESD+, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa MAX4022ESD+ sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Supply, Single / Dual (±): | 3.15 V ~ 11 V, ±1.575 V ~ 5.5 V |
|---|---|
| Boltahe - Input Offset: | 4mV |
| Supplier aparato Package: | 14-SOIC |
| magbaling Rate: | 600 V/µs |
| serye: | - |
| packaging: | Tube |
| Package / Kaso: | 14-SOIC (0.154", 3.90mm Width) |
| Type output: | Rail-to-Rail |
| operating Temperature: | -40°C ~ 85°C |
| Bilang ng Circuits: | 4 |
| Salalayan Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 14 Weeks |
| Manufacturer Bilang Bahagi: | MAX4022ESD+ |
| Ang pinalawak Paglalarawan: | Buffer Amplifier 4 Circuit Rail-to-Rail 14-SOIC |
| paglalarawan: | IC OPAMP BUFFER 200MHZ 14SOIC |
| Current - Supply: | 5.5mA |
| Current - Output / Channel: | 120mA |
| Current - Input Bias: | 5.4µA |
| Type amplifier: | Buffer |
| 3dB Bandwidth: | 200MHz |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa MAX4022ESD+
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers