Bumili MAX4461HEUT-T sa BYCHPS
Bumili na may garantiya
MAX4461HEUT-T
- Numero ng Bahagi:
- MAX4461HEUT-T
- Manufacturer:
- Maxim Integrated
- Paglalarawan:
- IC OPAMP INSTR 2.5MHZ RRO 6SOT
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 19692 Pieces
- Data sheet:
- 1.MAX4461HEUT-T.pdf2.MAX4461HEUT-T.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa MAX4461HEUT-T, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa MAX4461HEUT-T sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Supply, Single / Dual (±): | 2.85 V ~ 5.25 V |
|---|---|
| Boltahe - Input Offset: | 100µV |
| Supplier aparato Package: | 6-SOT |
| magbaling Rate: | 0.25 V/µs |
| serye: | - |
| packaging: | Tape & Reel (TR) |
| Package / Kaso: | SOT-23-6 |
| Type output: | Rail-to-Rail |
| operating Temperature: | -40°C ~ 85°C |
| Bilang ng Circuits: | 1 |
| Salalayan Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Bilang Bahagi: | MAX4461HEUT-T |
| Gain Bandwidth Product: | 2.5MHz |
| Ang pinalawak Paglalarawan: | Instrumentation Amplifier 1 Circuit Rail-to-Rail 6-SOT |
| paglalarawan: | IC OPAMP INSTR 2.5MHZ RRO 6SOT |
| Current - Supply: | 800µA |
| Current - Output / Channel: | 150mA |
| Current - Input Bias: | 1pA |
| Type amplifier: | Instrumentation |
| 3dB Bandwidth: | 25kHz |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa MAX4461HEUT-T
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers