Bumili MICROSMD010F-2 sa BYCHPS
Bumili na may garantiya
MICROSMD010F-2
- Numero ng Bahagi:
- MICROSMD010F-2
- Manufacturer:
- Littelfuse
- Paglalarawan:
- POLYSWITCH 0.10A RESET FUSE SMD
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 17194 Pieces
- Data sheet:
- 1.MICROSMD010F-2.pdf2.MICROSMD010F-2.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa MICROSMD010F-2, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa MICROSMD010F-2 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Max: | 30V |
|---|---|
| uri: | Polymeric |
| Oras upang Trip: | 1s |
| Kapal (Max): | 0.019" (0.48mm) |
| Sukat / Dimension: | 0.127" L x 0.102" W (3.22mm x 2.58mm) |
| serye: | PolySwitch®, microSMD |
| Resistance - Post Trip (R1) (Max): | 15 Ohm |
| Resistance - Inisyal (Ri) (Min): | 2.1 Ohm |
| Resistance - 25 ° C (Typ): | - |
| Ratings: | - |
| packaging: | Tape & Reel (TR) |
| Package / Kaso: | 1210 (3225 Metric), Concave |
| Ibang pangalan: | MICROSMD010F-2TR MICROSMD010F2 MICROSMD010FTR MICROSMD010FTR-ND RF1351-000 |
| operating Temperature: | -40°C ~ 85°C |
| Salalayan Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 2A (4 Weeks) |
| Tagagawa Standard Lead Time: | 17 Weeks |
| Manufacturer Bilang Bahagi: | MICROSMD010F-2 |
| Lead Spacing: | - |
| Taas - Makaupo (Max): | - |
| Ang pinalawak Paglalarawan: | PTC Resettable Fuse 30V Ih Surface Mount 1210 (3225 Metric), Concave |
| paglalarawan: | POLYSWITCH 0.10A RESET FUSE SMD |
| Current - Trip (Ito): | 250mA |
| Current - Max: | 10A |
| Current - Hold (Ih) (Max): | 100mA |
| Mga Pag-apruba: | CSA, TUV, UL |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa MICROSMD010F-2
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers