Bumili NANOSMDC075F-2 sa BYCHPS
Bumili na may garantiya
NANOSMDC075F-2
- Numero ng Bahagi:
- NANOSMDC075F-2
- Manufacturer:
- Littelfuse
- Paglalarawan:
- POLYSWITCH 0.75A RESET FUSE SMD
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 13642 Pieces
pagpapakilala
BYCHIPS ay ang stocking distributor para sa NANOSMDC075F-2, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa NANOSMDC075F-2 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Max: | 6V |
|---|---|
| uri: | Polymeric |
| Oras upang Trip: | 100ms |
| Kapal (Max): | 0.027" (0.68mm) |
| Sukat / Dimension: | 0.126" L x 0.063" W (3.20mm x 1.59mm) |
| serye: | PolySwitch®, nanoSMD |
| Resistance - Post Trip (R1) (Max): | 30 mOhm |
| Resistance - Inisyal (Ri) (Min): | 90 mOhm |
| Resistance - 25 ° C (Typ): | - |
| Ratings: | - |
| packaging: | Tape & Reel (TR) |
| Package / Kaso: | 1206 (3216 Metric), Concave, Long Side Terminals |
| Ibang pangalan: | NANOSMDC075F-2TR NANOSMDC075F2 NANOSMDC075FTR NANOSMDC075FTR-ND NANOSMDM075FTR RF1301-000 RF1301-000TR-ND RF1348-000 |
| operating Temperature: | -40°C ~ 85°C |
| Salalayan Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 2A (4 Weeks) |
| Tagagawa Standard Lead Time: | 17 Weeks |
| Manufacturer Bilang Bahagi: | NANOSMDC075F-2 |
| Lead Spacing: | - |
| Taas - Makaupo (Max): | - |
| Ang pinalawak Paglalarawan: | PTC Resettable Fuse 6V Ih Surface Mount 1206 (3216 Metric), Concave, Long Side Terminals |
| paglalarawan: | POLYSWITCH 0.75A RESET FUSE SMD |
| Current - Trip (Ito): | 1.5A |
| Current - Max: | 100A |
| Current - Hold (Ih) (Max): | 750mA |
| Mga Pag-apruba: | CSA, TUV, UL |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa NANOSMDC075F-2
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers