Bumili PM600DV1A060 sa BYCHPS
Bumili na may garantiya
PM600DV1A060
- Numero ng Bahagi:
- PM600DV1A060
- Manufacturer:
- Powerex, Inc.
- Paglalarawan:
- MOD IPM V1 DUAL 600A 600V
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 16920 Pieces
- Data sheet:
- PM600DV1A060.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa PM600DV1A060, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa PM600DV1A060 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Isolation: | 2500Vrms |
|---|---|
| Boltahe: | 600V |
| uri: | IGBT |
| serye: | Intellimod™ |
| Package / Kaso: | Power Module |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 18 Weeks |
| Manufacturer Bilang Bahagi: | PM600DV1A060 |
| Ang pinalawak Paglalarawan: | Power Driver Module IGBT 1 Phase Inverter 600V 600A Power Module |
| paglalarawan: | MOD IPM V1 DUAL 600A 600V |
| kasalukuyan: | 600A |
| configuration: | 1 Phase Inverter |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa PM600DV1A060
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
PM600HSA120 | Powerex Inc. | MOD IPM HF 1200V 600A | Pagtatanong |
|
PM600DVA060 | Powerex Inc. | MOD IPM HF 600V 600A | Pagtatanong |
 |
FNB41060 | Fairchild/ON Semiconductor | MOD SPM 600V 10A SPM26-AA | Pagtatanong |
|
PM600DSA060 | Powerex Inc. | MOD IPM DUAL HF 600V 600A | Pagtatanong |
 |
STGIPN3H60-H | STMicroelectronics | MOD IGBT SLLIMM NANO 26-NDIP | Pagtatanong |
|
PS11013 | Powerex Inc. | MOD IPM 3PHASE IGBT 600V 8A | Pagtatanong |
|
PM600CLA060 | Powerex Inc. | MOD IPM L-SER 6PAC IPM 600V 600A | Pagtatanong |
|
PM150RSA060 | Powerex Inc. | MOD IPM 7PAC 600V 150A | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers