Bumili PS22A76 sa BYCHPS
Bumili na may garantiya
PS22A76
- Numero ng Bahagi:
- PS22A76
- Manufacturer:
- Powerex, Inc.
- Paglalarawan:
- MOD IPM 1200V 25A LARGE DIP
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 13475 Pieces
- Data sheet:
- PS22A76.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa PS22A76, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa PS22A76 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Isolation: | 2500VDC |
|---|---|
| Boltahe: | 1200V |
| uri: | IGBT |
| serye: | DIPIPM™ |
| Package / Kaso: | 42-PowerDip Module (1.404", 35.67mm) |
| Ibang pangalan: | 835-1050 |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 20 Weeks |
| Manufacturer Bilang Bahagi: | PS22A76 |
| Ang pinalawak Paglalarawan: | Power Driver Module IGBT 3 Phase 1200V 25A 42-PowerDip Module (1.404", 35.67mm) |
| paglalarawan: | MOD IPM 1200V 25A LARGE DIP |
| kasalukuyan: | 25A |
| configuration: | 3 Phase |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa PS22A76
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
PM100DSA120 | Powerex Inc. | MOD IPM DUAL 1200V 100A | Pagtatanong |
 |
PS22A74 | Powerex Inc. | MOD IPM 1200V 15A LARGE DIP | Pagtatanong |
 |
PS22A78-E | Powerex Inc. | MOD IPM 1200V 35A LARGE DIP | Pagtatanong |
|
PS12013-A | Powerex Inc. | MOD IPM 3PHASE IGBT 1200V 5A | Pagtatanong |
 |
FSB50450T | Fairchild/ON Semiconductor | IC SPM 500V 3.0A 3PH SPM23AC | Pagtatanong |
 |
PS22A73 | Powerex Inc. | MOD IPM 1200V 10A LARGE DIP | Pagtatanong |
 |
PS22A72 | Powerex Inc. | MOD IPM 1200V 5A LARGE DIP | Pagtatanong |
 |
FPAB30BH60B | Fairchild/ON Semiconductor | MOD SPM 600V 30A SPM27-IC | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers