Bumili RNCS0805BKE1K00 sa BYCHPS
Bumili na may garantiya
RNCS0805BKE1K00
- Numero ng Bahagi:
- RNCS0805BKE1K00
- Manufacturer:
- Stackpole Electronics, Inc.
- Paglalarawan:
- RES SMD 1K OHM 0.1% 1/10W 0805
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 12983 Pieces
- Data sheet:
- 1.RNCS0805BKE1K00.pdf2.RNCS0805BKE1K00.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa RNCS0805BKE1K00, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa RNCS0805BKE1K00 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| pagpapaubaya: | ±0.1% |
|---|---|
| temperatura koepisyent: | ±25ppm/°C |
| Supplier aparato Package: | 0805 |
| Sukat / Dimension: | 0.079" L x 0.049" W (2.00mm x 1.25mm) |
| serye: | RNCS |
| Resistance (Ohms): | 1k |
| Power (Watts): | 0.1W, 1/10W |
| packaging: | Tape & Reel (TR) |
| Package / Kaso: | 0805 (2012 Metric) |
| Ibang pangalan: | RNCS 20 T9 1K 0.1% I RNCS0805BKE1K00TR RNCS20T91K0.1%ITR RNCS20T91K0.1%ITR-ND RNCS20T91KBITR RNCS20T91KBITR-ND |
| operating Temperature: | -55°C ~ 155°C |
| Bilang ng mga Terminations: | 2 |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 10 Weeks |
| Manufacturer Bilang Bahagi: | RNCS0805BKE1K00 |
| Taas - Makaupo (Max): | 0.026" (0.65mm) |
| Mga tampok: | Anti-Corrosive, Automotive AEC-Q200, Moisture Resistant |
| Pagkabigo Rate: | - |
| Ang pinalawak Paglalarawan: | 1k Ohm ±0.1% 0.1W, 1/10W Chip Resistor 0805 (2012 Metric) Anti-Corrosive, Automotive AEC-Q200, Moisture Resistant Thin Film |
| paglalarawan: | RES SMD 1K OHM 0.1% 1/10W 0805 |
| komposisyon: | Thin Film |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa RNCS0805BKE1K00
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers