Bumili SBC9-331-671 sa BYCHPS
Bumili na may garantiya
SBC9-331-671
- Numero ng Bahagi:
- SBC9-331-671
- Manufacturer:
- KEMET
- Paglalarawan:
- FIXED IND 330UH 670MA 580 MOHM
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 18630 Pieces
- Data sheet:
- SBC9-331-671.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa SBC9-331-671, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa SBC9-331-671 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| uri: | Wirewound |
|---|---|
| pagpapaubaya: | ±10% |
| Sukat / Dimension: | 0.472" Dia (12.00mm) |
| shielding: | Unshielded |
| serye: | SBC |
| Ratings: | - |
| Q @ Freq: | - |
| packaging: | Bulk |
| Package / Kaso: | Radial, Vertical Cylinder |
| operating Temperature: | - |
| Salalayan Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Material - Core: | Ferrite |
| Tagagawa Standard Lead Time: | 20 Weeks |
| Manufacturer Bilang Bahagi: | SBC9-331-671 |
| inductance: | 330µH |
| Taas - Makaupo (Max): | 0.472" (12.00mm) |
| Frequency - Test: | 10kHz |
| Frequency - Self Resonant: | - |
| Ang pinalawak Paglalarawan: | 330µH Unshielded Wirewound Inductor 670mA 580 mOhm Max Radial, Vertical Cylinder |
| paglalarawan: | FIXED IND 330UH 670MA 580 MOHM |
| DC pagtutol (DCR): | 580 mOhm Max |
| kasalukuyang Rating: | 670mA |
| Current - Saturation: | 1.6A |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa SBC9-331-671
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers