Bumili STGIPN3H60A sa BYCHPS
Bumili na may garantiya
STGIPN3H60A
- Numero ng Bahagi:
- STGIPN3H60A
- Manufacturer:
- ST
- Paglalarawan:
- IGBT IPM MODULE 3A 600V NDIP-26L
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 19598 Pieces
- Data sheet:
- STGIPN3H60A.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa STGIPN3H60A, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa STGIPN3H60A sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Isolation: | 1000VDC |
|---|---|
| Boltahe: | 600V |
| uri: | IGBT |
| serye: | SLLIMM™ |
| Package / Kaso: | 26-PowerDIP Module (0.846", 21.48mm) |
| Ibang pangalan: | 497-12115 |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Bilang Bahagi: | STGIPN3H60A |
| Ang pinalawak Paglalarawan: | Power Driver Module IGBT 3 Phase 600V 3A 26-PowerDIP Module (0.846", 21.48mm) |
| paglalarawan: | IGBT IPM MODULE 3A 600V NDIP-26L |
| kasalukuyan: | 3A |
| configuration: | 3 Phase |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa STGIPN3H60A
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
STGIPN3H60-H | STMicroelectronics | MOD IGBT SLLIMM NANO 26-NDIP | Pagtatanong |
|
STGIPN3H60T-H | STMicroelectronics | MOD IGBT SLLIMM NANO 26-NDIP | Pagtatanong |
 |
STGIPN3H60AT | STMicroelectronics | IGBT BIPO 600V 3A DIP | Pagtatanong |
 |
STGIPN3H60 | STMicroelectronics | IGBT IPM MODULE 3A 600V NDIP-26L | Pagtatanong |
 |
PS21961-4 | Powerex Inc. | MOD IPM 600V 3A SUPERMINI DIP | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers