Bumili US3J3PAK sa BYCHPS
Bumili na may garantiya
US3J3PAK
- Numero ng Bahagi:
- US3J3PAK
- Manufacturer:
- Littelfuse
- Paglalarawan:
- ACS LPSJ 30A 3 POLE ASSEMBLY KIT
- Lead Free Status / Katayuan ng RoHS:
- Naglalaman ng lead / RoHS di-sang-ayon
- Magagamit na Dami:
- 18200 Pieces
- Data sheet:
- US3J3PAK.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa US3J3PAK, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa US3J3PAK sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| serye: | * |
|---|---|
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Bilang Bahagi: | US3J3PAK |
| paglalarawan: | ACS LPSJ 30A 3 POLE ASSEMBLY KIT |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa US3J3PAK
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
64800001009 | Littelfuse Inc. | FUSEBLOCK COVER FOR 646/647 CLR | Pagtatanong |
 |
255.0808.0001 | Littelfuse Inc. | INSULATION NUT CF FUSE M8 BOLT | Pagtatanong |
 |
09130900Z | Littelfuse Inc. | TERMINAL SPECIALLY FOR FPA | Pagtatanong |
 |
2A1702-10 | Eaton | LINE SIDE DEAD FRONT ASSEMBLY | Pagtatanong |
 |
0853.1201 | Schurter Inc. | FUSE CARRIER OGN 5X20MM | Pagtatanong |
 |
9970620000 | Weidmuller | DIN RAIL CQB4 ANGLE COMB 2/IP | Pagtatanong |
 |
83500000005 | Littelfuse Inc. | CAP FOR 5X20MM FUSES FLUSH MOUNT | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog