Balita
Polymeric materials advance in packaging
The polymeric materials market revenue will double over the next five years, says Yole Développement, driven by miniaturisation and higher functionalities in applications like AI, 5G, and AR/VR requiring packaging including high-density FOWLP, 3D stacked TSV, WLCSP and flip-chip.
“The innovative advanced packaging platforms have reached a new level of complexity and now demand higher integration-level requirements,” says Yoke’s Amandine Pizzagalli, “these lofty standards will strongly influence the increasing demand for advanced materials with new technical specifications.”
Polymeric materials are already being applied in large-volume manufacturing in some advanced packaging process steps. Today, they have already found integration in major process steps: RDL, bump/UBM, TSV, and assembly levels, as well as at the bonding interface.
Yole identified a wide variety of polymeric materials available to packaging manufacturers: PI, PBO, BCB, epoxies, siloxanes, and acrylic, all of which are defined by their constant dielectric, cure temperature, stress, etc.
Polymeric materials present excellent electrical, chemical, and mechanical properties: they could offer better performance than any other type of materials… According to Yole’s report, materials will increasingly be implemented when adopting additional functionalities in the same field.
The polymeric materials market generated revenue in excess of $700 million in 2018.
It is expected to peak at about $1,3 billion by 2023 with a 12% CAGR depending on the material type over this period.
The market is driven by the dielectric material segment, analyzes Yole’s team in its report.
Polymeric materials growth will find support mostly from the expansion of dielectric material for more complex devices, followed by the broad introduction of polymeric temporary bonding material.
The latter will be accelerated by the ramp-up of 3D stacked TSV in DRAM memory applications.
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“The innovative advanced packaging platforms have reached a new level of complexity and now demand higher integration-level requirements,” says Yoke’s Amandine Pizzagalli, “these lofty standards will strongly influence the increasing demand for advanced materials with new technical specifications.”
Polymeric materials are already being applied in large-volume manufacturing in some advanced packaging process steps. Today, they have already found integration in major process steps: RDL, bump/UBM, TSV, and assembly levels, as well as at the bonding interface.
Yole identified a wide variety of polymeric materials available to packaging manufacturers: PI, PBO, BCB, epoxies, siloxanes, and acrylic, all of which are defined by their constant dielectric, cure temperature, stress, etc.
Polymeric materials present excellent electrical, chemical, and mechanical properties: they could offer better performance than any other type of materials… According to Yole’s report, materials will increasingly be implemented when adopting additional functionalities in the same field.
The polymeric materials market generated revenue in excess of $700 million in 2018.
It is expected to peak at about $1,3 billion by 2023 with a 12% CAGR depending on the material type over this period.
The market is driven by the dielectric material segment, analyzes Yole’s team in its report.
Polymeric materials growth will find support mostly from the expansion of dielectric material for more complex devices, followed by the broad introduction of polymeric temporary bonding material.
The latter will be accelerated by the ramp-up of 3D stacked TSV in DRAM memory applications.
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