Bumili 0230003.MXF17P sa BYCHPS
Bumili na may garantiya
0230003.MXF17P
- Numero ng Bahagi:
- 0230003.MXF17P
- Manufacturer:
- Littelfuse
- Paglalarawan:
- FUSE GLASS 3A 250VAC 125VDC 2AG
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 14191 Pieces
- Data sheet:
- 1.0230003.MXF17P.pdf2.0230003.MXF17P.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa 0230003.MXF17P, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa 0230003.MXF17P sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe Rating - DC: | 125V |
|---|---|
| Boltahe Rating - AC: | 250V |
| Sukat / Dimension: | 0.177" Dia x 0.571" L (4.50mm x 14.50mm) |
| serye: | 230 |
| Oras ng pagtugon: | Slow |
| packaging: | Bulk |
| Package / Kaso: | Cartridge, Non-Standard (Axial) |
| Ibang pangalan: | 0230003MXF17P 230003.MXF17P 230003MXF17P |
| operating Temperature: | -55°C ~ 125°C |
| Salalayan Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Melting I²t: | 77 |
| Tagagawa Standard Lead Time: | 9 Weeks |
| Manufacturer Bilang Bahagi: | 0230003.MXF17P |
| Type fuse: | Cartridge, Glass |
| paglalarawan: | FUSE GLASS 3A 250VAC 125VDC 2AG |
| DC Cold Resistance: | 0.0383 Ohm |
| kasalukuyang Rating: | 3A |
| kulay: | - |
| Breaking Capacity @ Rated Boltahe: | 100A AC, 10kA DC |
| Mga Pag-apruba: | CE, CSA, PSE, UL |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa 0230003.MXF17P
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers