Bumili 0603SFF600F/24-2 sa BYCHPS
Bumili na may garantiya
0603SFF600F/24-2
- Numero ng Bahagi:
- 0603SFF600F/24-2
- Manufacturer:
- Littelfuse
- Paglalarawan:
- FUSE BOARD MOUNT 6A 24VDC 0603
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 13895 Pieces
- Data sheet:
- 1.0603SFF600F/24-2.pdf2.0603SFF600F/24-2.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa 0603SFF600F/24-2, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa 0603SFF600F/24-2 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe Rating - DC: | 24V |
|---|---|
| Boltahe Rating - AC: | - |
| Sukat / Dimension: | 0.063" L x 0.031" W x 0.031" H (1.60mm x 0.80mm x 0.80mm) |
| serye: | SFF |
| Oras ng pagtugon: | Fast |
| packaging: | Tape & Reel (TR) |
| Package / Kaso: | 0603 (1608 Metric) |
| Ibang pangalan: | 0603SFF600F/24-2TR 0603SFF600F/242 0603SFF600F/24TR 0603SFF600F/24TR-ND 0603SFF600F/32-2 0603SFF600F/32TR 0603SFF600F/32TR-ND 0603SFF600F242 F97778-000 |
| operating Temperature: | -55°C ~ 125°C |
| Salalayan Type: | Surface Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Melting I²t: | 1.125 |
| Tagagawa Standard Lead Time: | 12 Weeks |
| Manufacturer Bilang Bahagi: | 0603SFF600F/24-2 |
| Type fuse: | Board Mount (Cartridge Style Excluded) |
| paglalarawan: | FUSE BOARD MOUNT 6A 24VDC 0603 |
| DC Cold Resistance: | 0.012 Ohm |
| kasalukuyang Rating: | 6A |
| kulay: | - |
| Breaking Capacity @ Rated Boltahe: | 35A |
| Mga Pag-apruba: | UL |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa 0603SFF600F/24-2
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers