Bumili 0835 001 S3B0 181 KLF sa BYCHPS
Bumili na may garantiya
0835 001 S3B0 181 KLF
- Numero ng Bahagi:
- 0835 001 S3B0 181 KLF
- Manufacturer:
- CTS Electronic Components
- Paglalarawan:
- CAP CER 180PF S3B RADIAL
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 19057 Pieces
- Data sheet:
- 0835 001 S3B0 181 KLF.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa 0835 001 S3B0 181 KLF, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa 0835 001 S3B0 181 KLF sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Rated: | - |
|---|---|
| pagpapaubaya: | ±10% |
| Kapal (Max): | - |
| temperatura koepisyent: | S3B |
| Sukat / Dimension: | 0.276" Dia (7.00mm) |
| serye: | - |
| Ratings: | - |
| packaging: | Bulk |
| Package / Kaso: | Radial, Disc |
| Ibang pangalan: | 0835001S3B0181KLF 835001A18LF |
| operating Temperature: | - |
| Salalayan Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 10 Weeks |
| Manufacturer Bilang Bahagi: | 0835 001 S3B0 181 KLF |
| Lead Style: | Straight |
| Lead Spacing: | 0.250" (6.35mm) |
| Taas - Makaupo (Max): | - |
| Mga tampok: | - |
| Pagkabigo Rate: | - |
| Ang pinalawak Paglalarawan: | 180pF ±10% Ceramic Capacitor S3B Radial, Disc |
| paglalarawan: | CAP CER 180PF S3B RADIAL |
| kapasidad: | 180pF |
| aplikasyon: | General Purpose |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa 0835 001 S3B0 181 KLF
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers