Bumili 0913774001 sa BYCHPS
Bumili na may garantiya
0913774001
- Numero ng Bahagi:
- 0913774001
- Manufacturer:
- Littelfuse
- Paglalarawan:
- ISO MINI TERMINAL 3.32-5.37M
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 13019 Pieces
- Data sheet:
- 1.0913774001.pdf2.0913774001.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa 0913774001, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa 0913774001 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| serye: | - |
|---|---|
| Ibang pangalan: | 913774001 913774001-ND |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Bilang Bahagi: | 0913774001 |
| Para sa Paggamit Sa / Kaugnay na Mga Produkto: | Fuseholder |
| paglalarawan: | ISO MINI TERMINAL 3.32-5.37M |
| accessory Type: | Crimp Terminal |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa 0913774001
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
0853.0576 | Schurter Inc. | COVER REFLOW W/CLAMP PCB 5X20MM | Pagtatanong |
 |
4400.042 | Schurter Inc. | KNURLED NUT CIRCUIT BRKR NICKEL | Pagtatanong |
 |
2A1630-10 | Eaton | MAIN DEVICE SUB ASSY 200A | Pagtatanong |
 |
913-774 | Littelfuse Inc. | ISO/MINI TERMINAL/ 3.32 5 | Pagtatanong |
|
0913772001 | Littelfuse Inc. | ISO MINI TERMINAL 0.5-0.8MM | Pagtatanong |
|
0913773001 | Littelfuse Inc. | ISO MINI TERMINAL 1.33-2.09M | Pagtatanong |
|
LF3J3PAK | Littelfuse Inc. | FUSE CLIP | Pagtatanong |
 |
2905584 | Phoenix Contact | SPARK GAP | Pagtatanong |
|
J-13 | Eaton | FUSE REDUCER | Pagtatanong |
|
0913728001 | Littelfuse Inc. | TERMINAL FOR 152003 | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers