Bumili 1115860000 sa BYCHPS
Bumili na may garantiya
1115860000
- Numero ng Bahagi:
- 1115860000
- Manufacturer:
- Weidmuller
- Paglalarawan:
- FUSE MODULE
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 17533 Pieces
- Data sheet:
- 1115860000.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa 1115860000, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa 1115860000 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| serye: | - |
|---|---|
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 5 Weeks |
| Manufacturer Bilang Bahagi: | 1115860000 |
| Para sa Paggamit Sa / Kaugnay na Mga Produkto: | - |
| paglalarawan: | FUSE MODULE |
| accessory Type: | Module |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa 1115860000
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
0859.0041 | Schurter Inc. | INSULATING COVER FOR FEU | Pagtatanong |
 |
913-007 | Littelfuse Inc. | FUSE CRIMP TERM 10GA FOR 868-062 | Pagtatanong |
 |
2905586 | Phoenix Contact | SPARK GAP | Pagtatanong |
 |
03455LS1HX020 | Littelfuse Inc. | FUSEHOLDER KNOB 5X20 SCREWDRVR | Pagtatanong |
 |
1A1706-08 | Eaton | EYELET 1-1/3A WHITE | Pagtatanong |
 |
840836 | Essentra Components | FUSE COVER .32 X 1.42 X .5" | Pagtatanong |
|
BO3-15 | Eaton | FUSEHOLDER CAP | Pagtatanong |
|
4121 | Eaton | BUSS TWIN CLIP ASSY | Pagtatanong |
|
3PH39P18MM | Littelfuse Inc. | BUSBAR 3 PHASE 39 POLE 18MM | Pagtatanong |
|
2A1633-2 | Eaton | GROUND ISOLATED | Pagtatanong |
|
840620 | Essentra Components | FUSE COVER .24 X .79 X .5" | Pagtatanong |
 |
0750.0141 | Schurter Inc. | FUSEHOLDER SCREW-ADAPTER 6.3X0.8 | Pagtatanong |
|
1PH6P18MM | Littelfuse Inc. | BUSBAR 1 PHASE 6 POLE 18X104MM | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog