Bumili 170N3427 sa BYCHPS
Bumili na may garantiya
170N3427
- Numero ng Bahagi:
- 170N3427
- Manufacturer:
- Bussmann (Eaton)
- Paglalarawan:
- FUSE 16A 660V 0000FU/65 GR
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 14073 Pieces
- Data sheet:
- 170N3427.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa 170N3427, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa 170N3427 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Sukat / Dimension: | - |
|---|---|
| serye: | * |
| packaging: | - |
| Package / Kaso: | - |
| Salalayan Type: | - |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 8 Weeks |
| Manufacturer Bilang Bahagi: | 170N3427 |
| paglalarawan: | FUSE 16A 660V 0000FU/65 GR |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa 170N3427
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
170N3433 | Eaton | FUSE 45A 660V 0000FU/65 GR | Pagtatanong |
|
170N3434 | Eaton | FUSE 50A 660V 0000FU/65 GR | Pagtatanong |
|
170N3437 | Eaton | FUSE 65A 660V 0000FU/65 GR | Pagtatanong |
|
170N3435 | Eaton | FUSE 55A 660V 0000FU/65 GR | Pagtatanong |
|
170N3430 | Eaton | FUSE 30A 660V 0000FU/65 GR | Pagtatanong |
|
170N3431 | Eaton | FUSE 35A 660V 0000FU/65 GR | Pagtatanong |
|
170N3436 | Eaton | FUSE 60A 660V 0000FU/65 GR | Pagtatanong |
|
170N3432 | Eaton | FUSE 40A 660V 0000FU/65 GR | Pagtatanong |
|
170N3426 | Eaton | FUSE 12A 660V 0000FU/65 GR | Pagtatanong |
|
170N3428 | Eaton | FUSE 20A 660V 0000FU/65 GR | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers