Bumili 1860200-1 sa BYCHPS
Bumili na may garantiya
1860200-1
- Numero ng Bahagi:
- 1860200-1
- Manufacturer:
- Potter & Brumfield Relays / TE Connectivity
- Paglalarawan:
- SOCKET W/O SCREW FOR DINRAIL
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 16445 Pieces
- Data sheet:
- 1860200-1.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa 1860200-1, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa 1860200-1 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| uri: | Socket |
|---|---|
| pagwawakas Style: | Screwless Clamp |
| serye: | RT, SCHRACK |
| Ibang pangalan: | PB1240 RT7872P |
| Bilang ng Posisyon: | 8 |
| Salalayan Type: | DIN Rail |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 17 Weeks |
| Manufacturer Bilang Bahagi: | 1860200-1 |
| Para sa Paggamit Sa / Kaugnay na Mga Produkto: | RT Series, SCHRACK |
| Mga tampok: | - |
| Ang pinalawak Paglalarawan: | Relay Socket DIN Rail |
| paglalarawan: | SOCKET W/O SCREW FOR DINRAIL |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa 1860200-1
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
2-1904045-1 | TE Connectivity Potter & Brumfield Relays | V23333Z0001A007-EV-311 | Pagtatanong |
 |
2955276 | Phoenix Contact | CONN TERM BLOCK | Pagtatanong |
|
1860214-1 | TE Connectivity Potter & Brumfield Relays | RELAY JUMPER LINK | Pagtatanong |
|
4-1904045-6 | TE Connectivity Potter & Brumfield Relays | V23333Z0001B046-EV-441 | Pagtatanong |
 |
P7S-14P | Omron Automation and Safety | SOCKET PC MNT FOR G7S RELAY | Pagtatanong |
|
2900449 | Phoenix Contact | TERM BLOCK | Pagtatanong |
 |
1860211-1 | TE Connectivity Potter & Brumfield Relays | RELAY ACCESSORIES | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog