Bumili 1860306-1 sa BYCHPS
Bumili na may garantiya
1860306-1
- Numero ng Bahagi:
- 1860306-1
- Manufacturer:
- Potter & Brumfield Relays / TE Connectivity
- Paglalarawan:
- SOCKET 5MM W/SCREW TERM DIN
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 14415 Pieces
- Data sheet:
- 1860306-1.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa 1860306-1, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa 1860306-1 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| uri: | Socket |
|---|---|
| pagwawakas Style: | Screw Terminal |
| serye: | RT, SCHRACK |
| Ibang pangalan: | 1860306-1-ND 18603061 PB1771 RT78725 |
| Bilang ng Posisyon: | 8 |
| Salalayan Type: | DIN Rail |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 17 Weeks |
| Manufacturer Bilang Bahagi: | 1860306-1 |
| Para sa Paggamit Sa / Kaugnay na Mga Produkto: | RT Series, SCHRACK |
| Mga tampok: | - |
| Ang pinalawak Paglalarawan: | Relay Socket DIN Rail |
| paglalarawan: | SOCKET 5MM W/SCREW TERM DIN |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa 1860306-1
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
HC4-WS-K | Panasonic Electric Works | SOCKET WRAP-WIRE/CLIP HC4 RELAY | Pagtatanong |
 |
PT11QN | Omron Automation and Safety | SOCKT BACK-CONNCTNG FOR LY RELAY | Pagtatanong |
 |
SP4-SS | Panasonic Electric Works | SOCKET SOLDERING FOR SP4 RELAY | Pagtatanong |
 |
5-1415034-1 | TE Connectivity Potter & Brumfield Relays | SOCKET W/SCREW FOR DINRAIL | Pagtatanong |
 |
SFS4-SFD-R | Panasonic Electric Works | TERMINAL SKT SPADE & RING 4POLE | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers