Bumili 1887103-3 sa BYCHPS
Bumili na may garantiya
1887103-3
- Numero ng Bahagi:
- 1887103-3
- Manufacturer:
- Potter & Brumfield Relays / TE Connectivity
- Paglalarawan:
- XT314R24
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 19049 Pieces
- Data sheet:
- 1887103-3.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa 1887103-3, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa 1887103-3 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| serye: | * |
|---|---|
| Ibang pangalan: | XT314R24 |
| Manufacturer Bilang Bahagi: | 1887103-3 |
| Ang pinalawak Paglalarawan: | Relay Coil |
| paglalarawan: | XT314R24 |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa 1887103-3
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
1887100-3 | TE Connectivity Potter & Brumfield Relays | RELAY GEN PURPOSE SPDT 16A 24V | Pagtatanong |
 |
1887103-1 | TE Connectivity Potter & Brumfield Relays | XT314T30 | Pagtatanong |
|
1887103-4 | TE Connectivity Potter & Brumfield Relays | XT314S15 | Pagtatanong |
|
1887102-6 | TE Connectivity Potter & Brumfield Relays | XT314L12 | Pagtatanong |
|
1887102-2 | TE Connectivity Potter & Brumfield Relays | XT314L24 | Pagtatanong |
 |
1887101-7 | TE Connectivity Potter & Brumfield Relays | RELAY GEN PURPOSE SPDT 16A 115V | Pagtatanong |
|
1887102-3 | TE Connectivity Potter & Brumfield Relays | XT314LB2 | Pagtatanong |
|
1887102-1 | TE Connectivity Potter & Brumfield Relays | XT314LC4 | Pagtatanong |
|
1887112-4 | TE Connectivity Potter & Brumfield Relays | XT374LE8 | Pagtatanong |
|
1887112-2 | TE Connectivity Potter & Brumfield Relays | XT374L24 | Pagtatanong |
|
1887112-6 | TE Connectivity Potter & Brumfield Relays | XT374L12 | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog