Bumili 27E636 sa BYCHPS
Bumili na may garantiya
27E636
- Numero ng Bahagi:
- 27E636
- Manufacturer:
- Potter & Brumfield Relays / TE Connectivity
- Paglalarawan:
- RELAY SOCKET 2 POLE PC STAG
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 13484 Pieces
- Data sheet:
- 27E636.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa 27E636, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa 27E636 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| uri: | Socket |
|---|---|
| pagwawakas Style: | PC Pin |
| serye: | R10 |
| Ibang pangalan: | 5-1393143-0 |
| Bilang ng Posisyon: | 10 |
| Salalayan Type: | Through Hole |
| Tagagawa Standard Lead Time: | 16 Weeks |
| Manufacturer Bilang Bahagi: | 27E636 |
| Para sa Paggamit Sa / Kaugnay na Mga Produkto: | R10 Series |
| Mga tampok: | Grounding Strip |
| Ang pinalawak Paglalarawan: | Relay Socket Through Hole |
| paglalarawan: | RELAY SOCKET 2 POLE PC STAG |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa 27E636
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
27E630 | TE Connectivity Potter & Brumfield Relays | SOCKET 6 POLES IN LINE | Pagtatanong |
 |
JRE200110 | Amphenol PCD | QUICK MOUNT, 2 POLE | Pagtatanong |
 |
1415044-1 | TE Connectivity Potter & Brumfield Relays | SOCKET 11PIN PCB TERM | Pagtatanong |
 |
208BR | TE Connectivity AMP Connectors | TERMINAL BLOCK | Pagtatanong |
 |
27E637 | TE Connectivity Potter & Brumfield Relays | RELAY SOCKET 4 POLE PC STAG | Pagtatanong |
 |
8869480000 | Weidmuller | SRC-1 2CO N | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog