Bumili 28B1122-300 sa BYCHPS
Bumili na may garantiya
28B1122-300
- Numero ng Bahagi:
- 28B1122-300
- Manufacturer:
- Laird Technologies - Signal Integrity Products
- Paglalarawan:
- FERRITE CORE 210 OHM SOLID
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 18549 Pieces
pagpapakilala
BYCHIPS ay ang stocking distributor para sa 28B1122-300, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa 28B1122-300 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| uri: | Round |
|---|---|
| serye: | 28 |
| Ratings: | - |
| Outer Dimensyon: | 1.122" Dia (28.50mm) |
| Salalayan Type: | Free Hanging |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| materyal: | 28 |
| Tagagawa Standard Lead Time: | 9 Weeks |
| Manufacturer Bilang Bahagi: | 28B1122-300 |
| Haba: | 0.787" (20.00mm) |
| Inner Dimensyon: | 0.542" Dia (13.77mm) |
| Impedance @ Frequency: | 210 Ohm @ 100MHz |
| Ang pinalawak Paglalarawan: | Solid Free Hanging Ferrite Core 210 Ohm @ 100MHz ID 0.542" Dia (13.77mm) OD 1.122" Dia (28.50mm) Length 0.787" (20.00mm) |
| disenyo: | Solid |
| paglalarawan: | FERRITE CORE 210 OHM SOLID |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa 28B1122-300
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
28B1122-100 | Laird-Signal Integrity Products | FERRITE CORE 307 OHM SOLID | Pagtatanong |
 |
ESD-R-12S | KEMET | FERRITE CORE SOLID 7MM | Pagtatanong |
 |
28B1142-100 | Laird-Signal Integrity Products | FERRITE CORE 114 OHM SOLID 19MM | Pagtatanong |
 |
FFAT-54 | API Delevan Inc. | FERRITE CORE 138 OHM TUBULAR 4MM | Pagtatanong |
 |
28B1142-000 | Laird-Signal Integrity Products | FERRITE CORE 85 OHM SOLID 19MM | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers