Bumili 28R1775-000 sa BYCHPS
Bumili na may garantiya
28R1775-000
- Numero ng Bahagi:
- 28R1775-000
- Manufacturer:
- Laird Technologies - Signal Integrity Products
- Paglalarawan:
- FERRITE CORE 260 OHM SOLID
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 15378 Pieces
pagpapakilala
BYCHIPS ay ang stocking distributor para sa 28R1775-000, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa 28R1775-000 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| uri: | Flat |
|---|---|
| serye: | 28 |
| Ratings: | - |
| Outer Dimensyon: | 1.775" W x 0.490" H (45.08mm x 12.45mm) |
| Ibang pangalan: | 10681 240-2086 28R1775000 RS1775X |
| Salalayan Type: | Free Hanging |
| materyal: | 28 |
| Tagagawa Standard Lead Time: | 8 Weeks |
| Manufacturer Bilang Bahagi: | 28R1775-000 |
| Haba: | 1.125" (28.58mm) |
| Inner Dimensyon: | 1.355" W x 0.060" H (34.42mm x 1.52mm) |
| Impedance @ Frequency: | 260 Ohm @ 100MHz |
| Ang pinalawak Paglalarawan: | Solid Free Hanging Ferrite Core 260 Ohm @ 100MHz ID 1.355" W x 0.060" H (34.42mm x 1.52mm) OD 1.775" W x 0.490" H (45.08mm x 12.45mm) Length 1.125" (28.58mm) |
| disenyo: | Solid |
| paglalarawan: | FERRITE CORE 260 OHM SOLID |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa 28R1775-000
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
28R1779-000 | Laird-Signal Integrity Products | FERRITE CORE 298 OHM SOLID | Pagtatanong |
 |
28R1779-100 | Laird-Signal Integrity Products | FERRITE CORE 170 OHM SOLID | Pagtatanong |
 |
ESD-R-25B | KEMET | FERRITE CORE CLAMP 13.9MM | Pagtatanong |
 |
28R1799-010 | Laird-Signal Integrity Products | FERRITE CORE 172 OHM SOLID | Pagtatanong |
 |
B-20L-48B | KEMET | FERRITE CORE SOLID 2.4MM | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog