Bumili 3100-30I17999CJ sa BYCHPS
Bumili na may garantiya
3100-30I17999CJ
- Numero ng Bahagi:
- 3100-30I17999CJ
- Manufacturer:
- Potter & Brumfield Relays / TE Connectivity
- Paglalarawan:
- RELAY CONTACTOR 3PST 60A 24V
- Lead Free Status / Katayuan ng RoHS:
- Naglalaman ng lead / RoHS compliant
- Magagamit na Dami:
- 19692 Pieces
- Data sheet:
- 3100-30I17999CJ.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa 3100-30I17999CJ, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa 3100-30I17999CJ sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| I-on Boltahe (Max): | 18 VAC |
|---|---|
| I-off ang Boltahe (Min): | 6 VAC |
| pagwawakas Style: | Box Lug, Quick Connect - 0.250" (6.3mm) |
| Paglipat Boltahe: | 600VAC - Max |
| serye: | 3100, Products Unlimited |
| Type relay: | Contactor |
| packaging: | Bulk |
| Ibang pangalan: | 4-1611022-8 |
| operating Temperature: | -40°C ~ 65°C |
| Salalayan Type: | Chassis Mount |
| Tagagawa Standard Lead Time: | 4 Weeks |
| Manufacturer Bilang Bahagi: | 3100-30I17999CJ |
| Mga tampok: | Insulation - Class B |
| Ang pinalawak Paglalarawan: | Contactor Relay 3PST-NO-DM (3 Form X) 24VAC Coil Chassis Mount |
| paglalarawan: | RELAY CONTACTOR 3PST 60A 24V |
| Contact Rating (Kasalukuyang): | 60A |
| Contact Material: | Silver Cadmium Oxide (AgCdO) |
| Contact Form: | 3PST-NO-DM (3 Form X) |
| Coil Boltahe: | 24VAC |
| Coil Type: | Non Latching |
| Coil Resistance: | 2.4 Ohms |
| Coil Power: | 14 VA |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa 3100-30I17999CJ
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers