Bumili 3186BE123T063APA1 sa BYCHPS
Bumili na may garantiya
3186BE123T063APA1
- Numero ng Bahagi:
- 3186BE123T063APA1
- Manufacturer:
- Cornell Dubilier Electronics
- Paglalarawan:
- CAP ALUM 12000UF 63V SCREW
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 15613 Pieces
- Data sheet:
- 3186BE123T063APA1.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa 3186BE123T063APA1, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa 3186BE123T063APA1 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| boltahe Rating: | 63V |
|---|---|
| pagpapaubaya: | -10%, +50% |
| Ibabaw Mount Land Size: | - |
| Sukat / Dimension: | 1.375" Dia (34.93mm) |
| serye: | 3186 |
| Ripple Kasalukuyang: | 8A @ 120Hz |
| polariseysyon: | Polar |
| packaging: | Bulk |
| Package / Kaso: | Radial, Can - Screw Terminals |
| Ibang pangalan: | Q4628372 |
| operating Temperature: | -40°C ~ 85°C |
| Salalayan Type: | Chassis Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 16 Weeks |
| Manufacturer Bilang Bahagi: | 3186BE123T063APA1 |
| Lifetime @ Temp.: | 1500 Hrs @ 85°C |
| Lead Spacing: | 0.500" (12.70mm) |
| impedance: | - |
| Taas - Makaupo (Max): | 4.125" (104.78mm) |
| Ang pinalawak Paglalarawan: | 12000µF 63V Aluminum Capacitors Radial, Can - Screw Terminals 21 mOhm 1500 Hrs @ 85°C |
| ESR (Katumbas Series pagtutol): | 21 mOhm |
| paglalarawan: | CAP ALUM 12000UF 63V SCREW |
| kapasidad: | 12000µF |
| aplikasyon: | General Purpose |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa 3186BE123T063APA1
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers