Bumili 34900-1502 sa BYCHPS
Bumili na may garantiya
34900-1502
- Numero ng Bahagi:
- 34900-1502
- Manufacturer:
- Potter & Brumfield Relays / TE Connectivity
- Paglalarawan:
- COIL KIT 208-240V
- Lead Free Status / Katayuan ng RoHS:
- Lead libreng / RoHS compliant
- Magagamit na Dami:
- 14999 Pieces
- Data sheet:
- 34900-1502.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa 34900-1502, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa 34900-1502 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| serye: | * |
|---|---|
| Ibang pangalan: | 1611381-3 349001502 |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 14 Weeks |
| Manufacturer Bilang Bahagi: | 34900-1502 |
| Ang pinalawak Paglalarawan: | |
| paglalarawan: | COIL KIT 208-240V |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa 34900-1502
| larawan | Numero ng Bahagi | Mga Tagagawa | Paglalarawan | Tingnan |
|---|---|---|---|---|
 |
PYCM-08S | Omron Automation and Safety | LEVER SOCKET RELEASE FOR PYF08S | Pagtatanong |
 |
2900949 | Phoenix Contact | RIF-RC-12-24 UC | Pagtatanong |
 |
J73K-CM-11S | Omron Automation and Safety | AUX CONTACTOR | Pagtatanong |
|
2701404 | Phoenix Contact | MARKER PIN LETTERING AREA | Pagtatanong |
|
G32A-A60-VD DC5-24 | Omron Automation and Safety | CARTRIDGE POWER DEVICE FOR G3PA | Pagtatanong |
 |
79237806 | Crouzet | DIN RAIL TO PANEL MOUNTING ADAPT | Pagtatanong |
 |
8869440000 | Weidmuller | SCM-I CLIP P | Pagtatanong |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers