Bumili 4306R-101-820 sa BYCHPS
Bumili na may garantiya
4306R-101-820
- Numero ng Bahagi:
- 4306R-101-820
- Manufacturer:
- Bourns, Inc.
- Paglalarawan:
- RES ARRAY 5 RES 82 OHM 6SIP
- Lead Free Status / Katayuan ng RoHS:
- Naglalaman ng lead / RoHS di-sang-ayon
- Magagamit na Dami:
- 13841 Pieces
- Data sheet:
- 4306R-101-820.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa 4306R-101-820, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa 4306R-101-820 sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| pagpapaubaya: | ±2% |
|---|---|
| temperatura koepisyent: | ±100ppm/°C |
| Supplier aparato Package: | 6-SIP |
| Sukat / Dimension: | 0.584" L x 0.085" W (14.83mm x 2.16mm) |
| serye: | 4300R |
| Resistance (Ohms): | 82 |
| Power Per Element: | 200mW |
| packaging: | Bulk |
| Package / Kaso: | 6-SIP |
| Ibang pangalan: | 4306R-1-820 |
| operating Temperature: | -55°C ~ 125°C |
| Bilang ng Resistors: | 5 |
| Bilang ng mga Pins: | 6 |
| Salalayan Type: | Through Hole |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Tagagawa Standard Lead Time: | 13 Weeks |
| Manufacturer Bilang Bahagi: | 4306R-101-820 |
| Taas - Makaupo (Max): | 0.195" (4.95mm) |
| Ang pinalawak Paglalarawan: | 82 Ohm ±2% 200mW Power Per Element Bussed Resistor Network/Array ±100ppm/°C 6-SIP |
| paglalarawan: | RES ARRAY 5 RES 82 OHM 6SIP |
| circuit Type: | Bussed |
| aplikasyon: | - |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa 4306R-101-820
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers