Bumili 50MT060WH sa BYCHPS
Bumili na may garantiya
50MT060WH
- Numero ng Bahagi:
- 50MT060WH
- Manufacturer:
- Vishay / Semiconductor - Diodes Division
- Paglalarawan:
- IGBT WARP 600V 114A MTP
- Lead Free Status / Katayuan ng RoHS:
- Naglalaman ng lead / RoHS di-sang-ayon
- Magagamit na Dami:
- 13830 Pieces
- Data sheet:
- 50MT060WH.pdf
pagpapakilala
BYCHIPS ay ang stocking distributor para sa 50MT060WH, mayroon kaming mga stock para sa agarang pagpapadala at magagamit din para sa mahabang panahon supply. Mangyaring ipadala sa amin ang iyong plano sa pagbili para sa 50MT060WH sa pamamagitan ng email, bibigyan ka namin ng pinakamahusay na presyo ayon sa iyong plano.
Mga pagtutukoy
| Boltahe - Kolektor Emitter Breakdown (Max): | 600V |
|---|---|
| Vce (on) (Max) @ Vge, Ic: | 3.2V @ 15V, 100A |
| Supplier aparato Package: | 12-MTP |
| serye: | - |
| Power - Max: | 658W |
| Package / Kaso: | 12-MTP Module |
| Ibang pangalan: | *50MT060WH VS-50MT060WH VS-50MT060WH-ND VS50MT060WH VS50MT060WH-ND |
| operating Temperature: | -40°C ~ 150°C (TJ) |
| NTC Thermistor: | No |
| Salalayan Type: | Chassis Mount |
| Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
| Manufacturer Bilang Bahagi: | 50MT060WH |
| Input Kapasidad (CIEs) @ Vce: | 7.1nF @ 30V |
| input: | Standard |
| Type IGBT: | PT |
| Ang pinalawak Paglalarawan: | IGBT Module PT Half Bridge 600V 114A 658W Chassis Mount 12-MTP |
| paglalarawan: | IGBT WARP 600V 114A MTP |
| Current - Kolektor Cutoff (Max): | 400µA |
| Current - kolektor (Ic) (Max): | 114A |
| configuration: | Half Bridge |
| Email: | [email protected] |
Mga Kaugnay na bahagi para sa 50MT060WH
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers